Microchip
Proprietary Neuromodulation IC
Silicon-proven, modular, and engineered to accelerate neuroscience and transform bio-electronic medicine.
Accumulated Know-How from
Academic & Industrial Innovation.
With over 15 years of dedicated IC development in biomedical engineering and AI, BioPro Scientific bridges the gap between theoretical neuroscience and practical clinical application. Our collaboration with Taiwan’s world-leading semiconductor industry (TSMC, UMC) allows us to deliver silicon-proven, highly reliable neuromodulation SoCs.
We don’t just design chips; we architect the future of bio-electronic medicine. Our proprietary miniaturized chips integrate analog front-ends, stimulation engines, and edge AI into a single efficient package, enabling a new generation of implantable and wearable devices. We welcome open collaboration to integrate our IPs into your next breakthrough.
Architecture Overview
Hover over blocks to explore the modular design.
Select a module to view specifications
Engineered for Excellence
Silicon-Proven IPs
All functional circuits—from neural recording and neuromodulation to wireless power and data—have been silicon-validated on both TSMC and UMC processes. Quarterly shuttle services allow continual verification of novel architectures. Our silicon-proven IP portfolio guarantees reliability, performance, and rapid support for next-generation bio-electronic medicine and neuromodulation devices.
Customizable Designs
We offer fully customized neuromodulation SoCs, built on our validated IPs. Customization covers channel count, power and data telemetry, DSP modules, on-chip ML, embedded memory, analog/digital partitioning, and more—transforming your ideas into high-quality semiconductor deliverables.
Advanced Fabrication & Packaging
With Taiwan’s microelectronics ecosystem, we provide access to advanced fabrication and packaging: chip bumping, flip-chip bonding, silicon-in-package (SiP), heterogeneous integration, and other high-end assembly services. These capabilities allow unprecedented freedom in bio-electronic medicine and neuromodulation device innovation.
Application Areas
Bio-electronic Medicine
Targeted modulation for chronic diseases.
Neuromodulation Devices
DBS, SCS, and VNS implantables.
Wearable Interfaces
Non-invasive EEG and EMG monitoring.
Implantable Devices
Pacemakers and bio-sensing implants.
Closed-loop Systems
Real-time responsive therapy.
Neuroscience Research
High-fidelity in vivo recording.
Wireless Power
Battery-free implant solutions.
AI Neural Analytics
On-chip biomarker classification.
Seamless Integration with
Taiwan's Semiconductor Ecosystem
Design-to-Manufacture Workflow
Requirement Definition
Specs & Feasibility
Architecture Planning
System Design
Circuit Design
Analog/Digital/RF
Fabrication
TSMC / UMC Tape-out
Packaging
SiP / Bumping / Wirebond
Verification
Electrical & Functional Test
Partner With Us to Build the
Future of Bio-electronic Medicine
We maintain an open collaboration model with researchers, startups, and med-tech companies. Let's discuss how our silicon-proven IPs can accelerate your product development.